SUZHOU HSF ELECTRONIC MATERIALS TECHNOLOGY CO., LTD.
Suzhou HSF Electronic Materials Technology Co., Ltd
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LDPE Release Film, D, 35micron, DG, UV Cured, Application of Tape, Sealing strip, No solvent or silicone transfer.
| 1 | Appearance | No air bubbles / stains / breakage / impurities | Measured | |
| 2 | Size | Width (mm) | 1070 -0+5 | 1071 |
| Thickness (mm) | 0.035 ± 0.005 | 0.036 | ||
| 3 | Tensile Strength (Mpa) | TD | ≥ 15 | 16 |
| MD | ≥ 15 | 23 | ||
| 4 | Color difference | Colorimeter △E | ＜ 3 | ok |
| 5 | Elongation @ break (%) | TD | ≥ 230 | 882 |
| MD | ≥ 230 | 443 | ||
| 6 | Surface Tension (Corona treatment) | Dyne Value | ≥42 dyne | 48 |
| 7 | Release Force (gf/25mm 20min.Finat 10) | Inner | 5-10 | 7 |
| Outer | 20-30 | 24 | ||
| 8 | Subsequent Adhesion (%) | Inner | ≥75 | 88 |
| Outer | ≥75 | 90 | ||
| 9 | Winding direction | Customized | - | |
| 10 | Splice No. | ≤1 | - | |
LDPE (high pressure low density polyethylene):
Non-toxic, tasteless, odorless, translucent spherical or cylindrical particles, excellent low temperature resistance,
chemical resistance, good extensibility, electrical insulation, but poor wetness, Flammable.
Density: 0.910—0.9408g/cm³, suitable for extrusion, blister, injection molding, vacuum, molding, and conversion
molding and other processing methods. The crystallinity is 55-65%, and the crystal melting point is 108-126 °C.
